发明名称 INK COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM FORMED FROM THE INK COMPOSITION, ELECTRONIC ELEMENT HAVING THE INSULATING FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an ink composition for forming an insulating film that can form a precision pattern by a reversed letterpress printing method and forms a gate insulating film having a small leakage current even with a very smooth surface shape and under atmosphere, also the insulating film formed from the ink composition, and an electronic element having the insulating film. <P>SOLUTION: The ink composition for forming an insulating film contains a resin component, an extender component, an organic solvent, and a mold release agent, wherein the resin component contains a polyvinyl phenol-based resin, and a ratio [the extender component/the resin component] is in the range of 0.03 to 0.1. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010265423(A) 申请公布日期 2010.11.25
申请号 JP20090119767 申请日期 2009.05.18
申请人 DIC CORP 发明人 ETORI HIDEKI;ISOZUMI HIROSHI;KASAI MASANORI
分类号 C09D11/00;C09D11/106;H01L21/312;H01L21/316 主分类号 C09D11/00
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