发明名称 THERMOPLASTIC RESIN COMPOSITION AND MOLDING THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition having high thin-wall fluidity and suppressing discoloration of a molded piece upon thermal exposure. SOLUTION: The thermoplastic resin composition includes: a polyamide having an alicyclic structure; a polyphenylene ether; and a compatibilizer of the polyamide and the polyphenylene ether, wherein the polyamide comprises a dicarboxylic acid unit containing 20 to 100 mol% cyclohexanedicarboxylic acid unit and a diamine unit containing a 6-12C aliphatic diamine unit, and wherein the polyphenylene ether has ≥60 mass% content of a component having molecular weight of 30,000 or less and ≤5 mass% content of a component having molecular weight of 3,000 or less. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010265380(A) 申请公布日期 2010.11.25
申请号 JP20090117724 申请日期 2009.05.14
申请人 ASAHI KASEI CHEMICALS CORP 发明人 MIYOSHI TAKAAKI
分类号 C08L77/06;C08K3/00;C08K5/092;C08L71/12 主分类号 C08L77/06
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