| 摘要 |
A semiconductor chip and an interposer are bonded by a conductive die bonding material. Between the semiconductor chip and the interposer, an application region in which the die bonding material resides and a region in which a sealing resin resides are provided. This allows adhesivity between the semiconductor chip and the interposer to be higher than that in conventional semiconductor packages, thereby causing no detachment at the adhesive interface. As a result, it becomes possible to improve electrical property and long-term reliability as compared to conventional semiconductor packages. Moreover, it is also possible to prevent the semiconductor chip from warping.
|
