| 摘要 |
<p>A method of producing an electronic component module is disclosed which connects chip-type components of a component-embedded layer to a substrate without having to prepare copper foil or other such material as an external terminal, and prevents position deviation in the chip-type components, when being embedded into the resin layer, without having to secure the chip-type components to copper foil or other such material. This electronic component module (1A) is produced by disposing bonding material (33) in a predetermined pattern onto a transfer sheet (4), mounting the chip type components (32) on the transfer sheet (4) by means of the bonding material (33) and embedding the chip type components (32) into the resin layer (31), peeling the bonding material (33) from the transfer sheet (4) so as to peel the resin layer (31) from the transfer sheet (4), and forming the component-embedded layer (3).</p> |
