| 摘要 |
<p>Disclosed are an electronic component mounting method and an electronic component mounting structure able to secure bonding strength for electronic components having bumps at the bottom surface. In electronic component mounting for mounting to a substrate (1) an electronic component (6) having bumps provided on the bottom surface by soldering, solder bonding material (3) containing solder particles in a first heat-curable resin is used for bonding the bumps (7) to electrodes (2) formed on a substrate (1), so as to form solder bonded parts (7*), at which the solder particles and the bumps (7) are melted and solidified, and first resin reinforcement parts (3a*) which reinforce the solder bonded parts (7*). Also, an adhesive (4) having, as a main ingredient, a second heat-curable resin that does not include solder particles is used for anchoring the outer edges (6a) of the electronic component (6) to the reinforcement points set for the substrate (1). Due to this, normal heat curing of the heat-curable resin is not impeded even when the solder bonding material (3) is mixed with the adhesive (4), and bonding strength can be secured for electronic components (6) which have bumps (7) on the lower surface.</p> |
