| 摘要 |
PROBLEM TO BE SOLVED: To provide a film adhesive used in a dicing step and a die-bonding step of a semiconductor wafer, which film adhesive ensures the alignment of a bump of a chip and a terminal of a substrate after picking up the chip. SOLUTION: The film adhesive 100 is obtained by sequentially laminating an adhesive layer 12, a thermosetting resin layer 30, and a second plastic layer 20 on a first plastic layer 10, wherein the area of the adhesive layer is bigger than the area of the thermosetting resin layer, and the thermosetting resin layer has parallel transmittance of visible light of 15-100% when uncured. COPYRIGHT: (C)2011,JPO&INPIT
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