发明名称 |
DIAMOND TOOL AND METHOD FOR MANUFACTURING SEGMENT THEREOF |
摘要 |
The present invention relates to a diamond tool for cutting a workpiece. An object of the present invention is to provide a diamond tool, wherein a wear-resistant region is formed in a connection portion between a segment and a shank of the diamond tool to prevent an under-cut phenomenon, to extend the service life of the diamond tool and to improve cutting quality due to easy discharge of cut chips. A diamond tool of the present invention for achieving the object has a cutting segment that contains a plurality of diamond granules and is attached to an outer peripheral surface of a shank, wherein the segment comprises an auxiliary cutting portion that has a thickness identical with that of the shank and a height and is attached to the shank; and a primary cutting portion that is integrally formed on the top of the auxiliary cutting portion and has a thickness larger than that of the auxiliary cutting portion.
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申请公布号 |
US2010294256(A1) |
申请公布日期 |
2010.11.25 |
申请号 |
US20070515273 |
申请日期 |
2007.04.24 |
申请人 |
SHINHAN DIAMOND IND. CO., LTD. |
发明人 |
LEE HYUN WOO;PARK JONG HWAN;PARK BU KUN;LIM JAE WOOK |
分类号 |
B23D61/02;B24D18/00;B28D1/04 |
主分类号 |
B23D61/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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