| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To inspect interlayer shift amount and shift direction between wiring patterns, by detecting the shift amounts and the shift direction of the respective wiring patterns of a multilayer printed wiring board. <P>SOLUTION: The multilayer printed wiring board is configured such that the wiring patterns for an inspection used for inspecting the wiring pattern in wiring pattern layers of at least two layers of a multilayer wiring pattern layer, through-holes provided in the wiring patterns for the inspection based on prescribed regular arrangement, and an interlayer connection part electrically connected to the respective wiring patterns for the inspection are formed. In the method for inspecting the multilayer printed wiring board, the energizing state of the respective wiring patterns for the inspection is detected using an energizing inspection part, the shift amounts in the prescribed direction of the respective wiring patterns, in which the wiring patterns for the inspection are formed, are calculated based on a detected result, and the relative shift amount in the prescribed direction between the respective wiring patterns is calculated based on the shift amounts in the prescribed direction of the respective wiring patterns. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
