| 摘要 |
PROBLEM TO BE SOLVED: To efficiently dissipates heat of an imaging device without complicating a heat dissipation structure interposed between an XY stage and a fixed stage. SOLUTION: An imaging unit 15 includes a movable member 51 capable of being displaced in an optical axis direction of a taking lens, between a retaining plate 29 which is displaced together with an XY stage 33 and is thermally coupled with a CCD 23 disposed on the XY stage 33, and a fixed stage 31 having heat dissipating property. A heat absorber 52 is connected to the side nearer to the retaining plate 29 of the movable member 51, and a thermally conductive rubber sheet 54 is disposed between the fixed stage 31 and the movable member 51 so as to be always in contact with both the fixed stage 31 and the movable member 51. In the imaging unit 15, when a temperature detected by a temperature sensor for detecting an ambient temperature of a CCD 23 becomes higher than a first temperature, the movable member 51 is displaced by a driving means to press-fit the heat absorber 52 to the retaining plate 29. COPYRIGHT: (C)2011,JPO&INPIT |
