| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents disconnection of a bonding wire caused by swing of gel-like filling material filled in a case, and improves vibration resistance strength. <P>SOLUTION: The semiconductor device includes the gel-like filling material 8 filled in the case 7 to protect a semiconductor element and the bonding wire. The gel-like filling material 8 is filled in the case 7 to bring a vibration direction K generated in the semiconductor device 1 and a short side direction S of the gel-like filling material 8 in line. The gel-like filling material 8 easily resonates with vibration applied on the semiconductor device in a longitudinal direction L, while hardly resonates in a short side direction S. Therefore, swing of the gel-like filling material is suppressed, to prevent disconnection of the bonding wire. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
