| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for COF (Chip On Film) used for sealing a narrow gap as about 20μm or a narrow pitch of about 20 to 30μm (in a line/space (L/S) ratio of about (10 to 15μm)/(10 to 15μm)) of a COF type semiconductor device, which is applied to a usage requiring high reliability, and to provide a method for producing the composition. SOLUTION: The method for producing the resin composition for COF sealing comprises: compounding components of a resin composition for COF sealing including an epoxy resin, a curing agent and an inorganic filler; and then filtering the compounded material by using a filter having a mesh size of 1μm. COPYRIGHT: (C)2011,JPO&INPIT |
