| 摘要 |
A monitoring apparatus is provided with an imaging section which can partially pick up an image of a wafer (10). The monitoring apparatus monitors the surface of the wafer (10) by using partial images (A, A and so on) of the wafer (10) in a plurality of imaging regions. The partial images are obtained by picking up the images of a plurality of parts of the wafer (10) (an apex section (13)), while relatively moving the imaging region of the imaging section in the circumference direction of the wafer (10). The monitoring apparatus is provided with an image connecting section and an image display section. The image connecting section compresses partial images (A, A and so on) so that each compression ratio in a direction corresponding to the circumference direction of the wafer (10) is larger than that in the direction vertical to such direction, then, the image connecting section connects the partial images to be arranged in the circumference direction to obtain a connected image (B) by which the apex section (13) of the wafer (10) can be continuously visible in the circumference direction. The image display section displays the connected image (B) wherein the partial images are connected by the image connecting section.
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