发明名称 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND CURED PRODUCT OF THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an alkali developable photosensitive resin composition which is environmentally friendly, and to provide a dry film and the cured product of the composition, and to provide a printed circuit board having the cured film of the composition formed thereon. <P>SOLUTION: The photosensitive resin composition contains (A) a resin made of recovered polyester as a raw material and (B) a photoinitiator. Preferably, the resin (A) is a polyol, a carboxyl group-containing resin or a photosensitive resin having an ethylenically unsaturated group; and in particular, the resin (A) is a polyol obtained by depolymerization of a recovered polyester (a) with a polyol (b) having two ore more hydroxyl groups in one molecule, or a carboxyl group-containing resin obtained by reacting a polybasic acid or its anhydride (c) with recovered polyester before, during or after the depolymerization. More preferably, the photosensitive resin composition contains a carboxyl group-containing photosensitive resin (C) except for the resin (A). More preferably, the photosensitive resin composition contains a thermosetting component (D), and further a colorant (E). <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010266518(A) 申请公布日期 2010.11.25
申请号 JP20090115458 申请日期 2009.05.12
申请人 TAIYO INK MFG LTD 发明人 OKAMOTO DAICHI;ARIMA MASAO
分类号 G03F7/004;C08F2/44;C08F20/20;C08F299/00;C08G18/67;C08J11/24;G03F7/032;G03F7/038;H05K3/28 主分类号 G03F7/004
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