| 发明名称 |
SCRIBE-LINE THROUGH SILICON VIAS |
| 摘要 |
A semiconductor wafer includes dies to be scored from the semiconductor wafer. The semiconductor wafer also includes scribe-lines between the dies. Each scribe-line includes multiple through silicon vias. |
| 申请公布号 |
WO2010091245(A8) |
申请公布日期 |
2010.11.25 |
| 申请号 |
WO2010US23309 |
申请日期 |
2010.02.05 |
| 申请人 |
QUALCOMM INCORPORATED;CHANDRASEKARAN, ARVIND |
发明人 |
CHANDRASEKARAN, ARVIND |
| 分类号 |
H01L21/78 |
主分类号 |
H01L21/78 |
| 代理机构 |
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代理人 |
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| 主权项 |
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