SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package that can reduce stress generated, in a jointing part jointing a semiconductor device to a wiring board to prevent the jointing part from cracking, when the semiconductor package is to be heated.

SOLUTION: The semiconductor package 10 has the semiconductor device 20 packaged on the wiring board 30. The semiconductor device includes a semiconductor substrate 21; a through electrode 25 that penetrates the semiconductor substrate and electrically connects the wiring board to the semiconductor device; and an annular recess 26 open to the side of the wiring board of the semiconductor substrate provided around the through electrode.

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