| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a white liquid photosensitive resin composition having reduced discoloring of a white coating film and deterioration in reflectance due to UV irradiation and a thermal history, and forming a pattern with a low amount of exposure. <P>SOLUTION: The white photo-curing resin composition contains: (A) a carboxyl group-containing photosensitive resin having no aromatic ring; (B) photopolymerization initiator; (C) a diluent; (D) titanium dioxide; and (E) one or more kinds of epoxy compounds selected from epoxy compounds represented by formulas (1), (2), (3) and (4). <P>COPYRIGHT: (C)2011,JPO&INPIT |
| 申请公布号 |
JP2010266556(A) |
申请公布日期 |
2010.11.25 |
| 申请号 |
JP20090116166 |
申请日期 |
2009.05.13 |
| 申请人 |
TAMURA SEISAKUSHO CO LTD |
发明人 |
KIYOTA TATSUYA;NISHIYAMA HIROYASU;HASEGAWA YASUYUKI;OKAMOTO YOSHIO |
| 分类号 |
G03F7/004;C08F2/44;G03F7/027 |
主分类号 |
G03F7/004 |
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