发明名称 ELECTRICALLY CONDUCTIVE CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide superior flexibility even in a card having a thickness not more than a thickness of a general card without a large bulge, and to change over an electrically conductive state using an electrically conductive pattern. <P>SOLUTION: The electrically conductive circuit board includes: two antenna patterns 20a, 20b formed with a gap on a base substrate 30; a non-curable resin 40 disposed on the base substrate 30 such that the non-curable resin 40 straddles the two antenna patterns 20a, 20b; an IC chip 10 disposed on the non-curable resin 40 such that the IC chip 10 faces the two antenna patterns 20a, 20b; and a covering film 50 disposed on the base substrate 30 such that the covering film 50 covers the IC chip 10 and the non-curable resin 40, capable of being deformed by external force, and restoring to an original shape when application of the external force is lost. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010267149(A) 申请公布日期 2010.11.25
申请号 JP20090119185 申请日期 2009.05.15
申请人 TOPPAN FORMS CO LTD 发明人 SHOJI YOHEI;NAKAYAMA YUSUKE
分类号 G06K19/077;G06K19/07;G06K19/073 主分类号 G06K19/077
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