| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and system capable of relatively easily determining inspection conditions in a wafer inspection even for a user having no expertise. SOLUTION: In this wafer inspection condition determining method and system, an inspection condition data base 115 storing information over images imaged in the past and inspection conditions for these images is provided; an analysis control unit 114 displays a plurality of sample images and inspection conditions for these sample images which are stored in the inspection condition data base 115 in an image processing unit 113; from a plurality of sample images and inspection conditions which are displayed through an input part, predetermined inspection conditions are selected and through the input part, a predetermined region in a wafer is selected; the selected region is imaged by an electron beam wafer inspection apparatus 100 under selected inspection conditions to obtain an obtained image; and the analysis of the obtained image is performed and based on the result of the analysis, an evaluation of the predetermined inspection conditions is performed. COPYRIGHT: (C)2011,JPO&INPIT |
