| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component built-in wiring board manufactured at low cost while maintaining the reliability in connection with a semiconductor substrate and the function as the wiring board; and to provide a method of manufacturing the same. <P>SOLUTION: The wiring board includes a first insulating layer, a second insulating layer laminated on it, a semiconductor element embedded in the second insulating layer and having a terminal pad, a first wiring pattern which is interposed between the first and second insulating layers in contact with them, includes a surface-gilded connection land and is not surface-gilded except the connection land, a connection member making the terminal pad of the semiconductor element and the connection land electrically conductive, a resin applied to seal the connection member within it, and a second wiring pattern provided on a surface of the first insulating layer opposite to the surface on which the first wiring pattern is provided. An interlayer connection makes each first wiring pattern connected with the connection land and the second wiring pattern electrically conductive. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
