| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive member which has stable contact resistance, is hardly peeled, displays a low insertion/removal force and is stable when used as a connector, and has an excellent fusing characteristic when used as a fuse. SOLUTION: A Cu-Sn intermetallic compound layer 4 is formed between a Ni-based underlayer 3 formed on a Cu-based base material 1, and a Sn-based surface layer 5 that forms the surface. In addition, the Cu-Sn intermetallic compound layer 4 comprises a Cu<SB>3</SB>Sn layer 6 disposed on the Ni-based underlayer 3 and a Cu<SB>6</SB>Sn<SB>5</SB>layer 7 that is disposed on the Cu<SB>3</SB>Sn layer 6. The surface roughness of the face, brought into contact with the Sn-based surface layer 5, of the Cu-Sn intermetallic compound layer 4 combining the Cu<SB>3</SB>Sn layer 6 and Cu<SB>6</SB>Sn<SB>5</SB>layer 7 is 0.05-0.25μm in arithmetic average roughness Ra, and the maximum valley depth Rv of the roughness curve is 0.05-1.00μm. Furthermore, the Cu<SB>3</SB>Sn layer covers the Ni-based underlayer with an area coverage of 60-100%. COPYRIGHT: (C)2011,JPO&INPIT
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