| 摘要 |
PROBLEM TO BE SOLVED: To provide a light and heat curing resin composition possessing all of flexibility and low moisture permeability which are incompatible properties and adhesion to a PET substrate, to provide a light and heat curing moisture-proof sealing material for electronic paper, using the same, and to provide electronic paper using the same. SOLUTION: The light curing resin composition comprises (A) an ethylenically unsaturated double bond-containing urethane compound obtained by reacting (a1) a polyolefin polyol compound with (a2) a hydroxyl-containing ethylenically unsaturated compound and (a3) a compound having two or more isocyanate groups in the molecule, (B) a photopolymerizable monomer, (C) a photopolymerization initiator, (D) an epoxy compound, and (E) an imidazole-type curing agent. COPYRIGHT: (C)2011,JPO&INPIT
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