发明名称 PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a safety printed wiring board in which conductive parts are hardly oxidized and corroded, even if each layer constituting the printed wiring board is made thin, and to provide a method for manufacturing the same. SOLUTION: The printed wiring board comprises a substrate body 10 and a conductive pattern 14 formed a circuit on the substrate body 10. The substrate body 10 is made from an insulating material, such as polyethylene terephthalate, polyimide and liquid crystalline polymer. The conductive pattern 14 is formed of conductive members such as copper, and both rims 14a, 14a where an upper surface 14b and each side surface 14c, 14c cross, are formed in a R shape. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010267891(A) 申请公布日期 2010.11.25
申请号 JP20090119404 申请日期 2009.05.18
申请人 FUJIKURA LTD 发明人 OGAWA TAIJI
分类号 H05K1/02;H05K3/06 主分类号 H05K1/02
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