摘要 |
PROBLEM TO BE SOLVED: To solve a problem that high-density mounting is difficult as electronic device and the like can not be mounted on an area where a heater is mounted, since in a conventional heat pipe panel, the heater for heating the electronic device and the like and retaining heat thereof is mounted on a device loading face. SOLUTION: In this heat pipe panel 20, the heater is adhered to a heat pipe 11, protected by a heater wiring take-out unit 16, and then adhered to a honeycomb core 6, a surface at a device loading face side, and a surface at a heat exhaust face side (cosmic space side). The wiring of the heater is taken out onto the surface of the device loading face through the heater wiring take-out unit, and connected to a control device. COPYRIGHT: (C)2011,JPO&INPIT |