发明名称 Bending-Type Rigid Printed Wiring Board and Process for Producing the Same
摘要 This invention provides a bending-type rigid printed wiring board that can easily realize mounting of electric components (can realize a plated circuit having high productivity and assembling properties), can realize space saving, and can realize easy production. The bending-type rigid printed wiring board comprises a hard cure material (1) with a space part (1A) inserted thereinto. A heat-resistant resin layer (31) is stacked on the surface of the hard core material (1) and, at the same time, on the upper surface of the space part (1A). A heat-resistant resin layer (32) is stacked on the backside of the core material (1) except for the space part (1A). Further, a conductor layer (4) is stacked and fixed through the heat-resistant resin layers (31, 32). The conductor layer (4) has been etched to form a circuit.
申请公布号 US2010294544(A1) 申请公布日期 2010.11.25
申请号 US20060989679 申请日期 2006.07.28
申请人 MOMOTA ATSUSHI;TERUNUMA ICHIRO;HASEGAWA TAKESHI;TAKEMURA YASUO;HATAKEYAMA YOSHIFUMI;HARADA HIROSHI;KATOH MAKOTO 发明人 MOMOTA ATSUSHI;TERUNUMA ICHIRO;HASEGAWA TAKESHI;TAKEMURA YASUO;HATAKEYAMA YOSHIFUMI;HARADA HIROSHI;KATOH MAKOTO
分类号 H05K1/00;H05K3/00 主分类号 H05K1/00
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