| 发明名称 |
INTERCONNECT FOR TIGHTLY PACKED ARRAYS WITH FLEX CIRCUIT |
| 摘要 |
Exemplary embodiments provide interconnects and methods for interconnecting an electrical device array with a flexible circuit by filling a chemically-etched or laser-ablated integral stencil with conductive materials
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| 申请公布号 |
US2010294545(A1) |
申请公布日期 |
2010.11.25 |
| 申请号 |
US20090470047 |
申请日期 |
2009.05.21 |
| 申请人 |
XEROX CORPORATION |
发明人 |
MASSOPUST DAN LEO;ANDREWS JOHN RICHARD;SLENES CHAD J. |
| 分类号 |
H05K3/10;H05K1/00 |
主分类号 |
H05K3/10 |
| 代理机构 |
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