SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME

摘要

The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising a first binder having a rosin compound and a tin-containing alloy with a melting point of from 130 to 300°C, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.