| 摘要 |
PURPOSE: A light emitting device, method for fabricating the light emitting device and light emitting device package are provided to separate light emitting device from a metal support layer by removing remaining metal layer. CONSTITUTION: A light emitting structure is formed on the first side of a metal support(160). The light emitting structure comprises a second conductive semiconductor layer and a first conductive semiconductor layer. The metal support layer is functioned as an electrode. A junction layer(170) is formed on the second side of the metal support layer. |
