发明名称 ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve the soldering and mounting quality of an electronic component and a circuit board and so on. SOLUTION: A base 3 is made of a glass having through electrodes 7, 17 formed thereon, and an external electrode 8 which conducts with an electrode of a crystal vibrator 6 is formed on a bottom surface of the base 3. The external electrode 8 includes: an electrode film 31 for bonding, which is bonded to solder during soldering; and an oxidation-preventive film 51 formed thereupon. The oxidation preventive film 51 is formed by stacking an Au layer and a Cr layer alternately, and a front surface of an Au layer is bonded to the electrode film 31 for bonding. The total thickness of Au layers constituting the oxidation preventive film 51 is set to 300 to 100[nm], preferably, 300 to 450[nm], and a thickness which is thick enough to effectively prevent oxidation of the electrode film 31 for bonding is secured, embrittlement of the solder due to too much Au being prevented. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010267739(A) 申请公布日期 2010.11.25
申请号 JP20090116887 申请日期 2009.05.13
申请人 SEIKO INSTRUMENTS INC 发明人 TAKEUCHI HITOSHI;SATO KEIJI;ARATAKE KIYOSHI;NAKAMURA NORIHIKO;TERADA DAISUKE;NUMATA SATOSHI;SUGIYAMA TAKESHI
分类号 H01L23/12;H01L23/02;H01L23/15;H03H3/02;H03H9/02 主分类号 H01L23/12
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