| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high wet heat resistance, a high elastic modulus of a cured product at high temperature and excellent hollow structure retention property, and to provide a method for forming a rib pattern using the composition, and electronic components. <P>SOLUTION: The photosensitive resin composition contains (A) a polyamic acid, (B) a photopolymerizable compound having an ethylenically unsaturated group, (C) a heat-polymerizable compound having at least one methylol group or alkoxyalkyl group, and (D) a photopolymerization initiator. <P>COPYRIGHT: (C)2011,JPO&INPIT |
