发明名称 CURABLE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable resin composition having good workability and superior developability and giving a cured product that can achieve good electric characteristics and reliability such as high moisture heat resistance, which are required when the composition is used for electronic parts or the like. <P>SOLUTION: The curable resin composition includes the following carboxyl group-containing photosensitive resin and a photopolymerization initiator. The photosensitive resin is obtained through steps of reacting a phenolic resin with an alkylene oxide or cyclocarbonate to obtain a reaction product, reacting the reaction product with an unsaturated group-containing monocarboxylic acid, and reacting the resultant reaction product with a polybasic acid anhydride. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010266745(A) 申请公布日期 2010.11.25
申请号 JP20090118731 申请日期 2009.05.15
申请人 TAIYO INK MFG LTD 发明人 ITO NOBUHITO;ARIMA MASAO
分类号 G03F7/027;C08F290/14;C08G14/12;G03F7/004;H05K3/28 主分类号 G03F7/027
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