| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component capable of obtaining high reliability without increasing the number of components and any manufacturing man-hour by alleviating deterioration of a junction part and cracks generated on boundaries or the like with the electronic component due to stress repeatedly arising by a dimensional change caused by thermal expansion/contraction of a molding resin, since a temperature cycle of high/low temperatures is repeated in an electronic component mounting structure which is integrally formed with the molding resin by using a leadframe as a conducting pattern and a mounting electrode for the electronic component in an on-board sensor used in environments which are severe in a using condition and a weather condition. <P>SOLUTION: In the electronic component mounting structure which is integrally formed with the molding resin 4 by using the leadframe 1 as the conducting pattern and an electronic component mounting electrode (electronic component mounting surface 12), a bend 11 is provided in the leadframe 1. The stress applied to a junction part 3 of the electronic component 2 can be remarkably decreased, since the bend 11 is deformed and absorbs the stress. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
