| 摘要 |
PROBLEM TO BE SOLVED: To prevent oxidation of solder jetted from a nozzle. SOLUTION: A cover body 40 has an opening portion 43 for inserting a nozzle portion 3 and a side wall 42 positioned outside from the opening portion 43, and covers a part of a solder housing portion 2. A supply pipe 45 has a plurality of supply ports 46 for supplying a nitrogen gas to the side wall 42 side, and is provided between the opening portion 43 and the side wall 42 so as to surround the opening portion 43. With this configuration, the nitrogen gas supplied from the supply ports 46 is supplied toward the side wall 42, and stored between the nozzle portion 3 and the side wall 42, and a liquid surface of the solder 20. The gas density of the stored nitrogen gas becomes high. The nitrogen gas having high gas density is jetted from the opening portion 43, and sprayed to the solder 20 jetted from the nozzle portion 3. Thus, oxidation of the solder can be prevented. As this result, bridge failure or icicle failure caused by solder adhering to a portion other than a predetermined portion can be prevented. COPYRIGHT: (C)2011,JPO&INPIT |
