发明名称 DUAL-CHAMBER FLUID PUMP FOR A MULTI-FLUID ELECTRONICS COOLING SYSTEM AND METHOD
摘要 A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.
申请公布号 US2010296248(A1) 申请公布日期 2010.11.25
申请号 US20100850104 申请日期 2010.08.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CAMPBELL LEVI A.;CHU RICHARD C.;ELLSWORTH, JR. MICHAEL J.;IYENGAR MADHUSUDAN K.;SCHMIDT ROGER R.;SIMONS ROBERT E.
分类号 H05K7/20;F04B43/04;F28D15/00 主分类号 H05K7/20
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