| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a mounting structure for reducing air bubbles that occur between an electronic component and an insulating resin. <P>SOLUTION: The manufacturing method includes an insulating resin arranging step of forming a sheet-like insulating resin 16 on a circuit board 14, a mounting step in which an electronic component 11 is positioned from above the insulating resin 16 so that a bump 13 formed on an electrode 12 of the electronic component 11 is opposed to a counter electrode 15 of the circuit board 14, and a joining step where the insulating resin 16 is cured by heating and pressurizing so that the electronic component 11 is joined to the circuit board 14. The side surface of the insulating resin 16 has such a shape as the portion abutting with the insulating resin 16 and a lower surface of the electronic component 11 expand as the electronic component 11 gets down when aligned in the mounting step or when joined in the joining step. <P>COPYRIGHT: (C)2011,JPO&INPIT |
