| 摘要 |
A universal test socket includes a housing frame including a side wall, an inner protruding portion protruding inwardly from the side wall, and a through window formed at a center portion of the housing frame, wherein the through window is surrounded by the side wall, a pin plate assembly coupled to the housing frame and including a pin plate in which a plurality of test pins are arranged and a plurality of guide pins formed on periphery of the pin plate, and a package guide portion coupled to the housing frame and located above the pin plate assembly, a semiconductor package to be tested being mounted on the package guide portion. When the pin plate assembly is coupled to the housing frame, the positions of the test pins arranged in the housing frame are varied according to a rotation angle of the pin plate assembly with respect to the housing frame.
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