POLISHING PAD FOR CMP AND POLISHING METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad for CMP capable of polishing a workpiece to be processed as to obtain highly accurate in-plane uniformity.

SOLUTION: The polishing pad for CMP is formed of hard foaming polyurethane and has an inner region whose polishing face is circular and a doughnut shape outer polishing region surrounding the inner polishing face. Bubble density of the inner region is higher than that of the outer region, and the asker D hardness of the outer region and the inner region are both 45 to 70, and a hardness difference between them is three or less.

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