发明名称 POSITIVE PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition having a low dielectric constant, high transparency, high solvent resistance, high water resistance, high acid resistance, high alkali resistance, high heat resistance, excellent adhesion to a base, and the like, the composition which is useful for forming a patterned organic film obtained by developing with an alkali aqueous solution. <P>SOLUTION: The positive photosensitive composition includes: a copolymer that includes an acrylate-based or styrene-based radical polymerizable monomer unit of a specified structure including a silicon atom; and a 1,2-quinonediazide compound. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010266733(A) 申请公布日期 2010.11.25
申请号 JP20090118562 申请日期 2009.05.15
申请人 CHISSO CORP 发明人 KIMURA YUKI;SATO HIROYUKI
分类号 G03F7/023;C08F220/18;G03F7/075 主分类号 G03F7/023
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