| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device for being assembled simply as the semiconductor device requiring an electrical and mechanical coupling and for improving productivity. <P>SOLUTION: In a conductor device module 100, terminal holes 110 and lock grooves 120 electrically connected to the terminals 102 of the semiconductor element 101 with their inner surfaces as conductive ones are bored. Terminal holes 210 and through-holes 220 serving as the terminals of a control circuit with their inner surfaces as conductive ones are provided to a control circuit board 200 at the positions corresponding to the terminal holes 110 and the lock grooves 120. Pins 310 with the part corresponding to the terminal holes 110 and the terminal holes 210 and being widened so as to be firmly attached, and lock pins 320 inserted through the through-holes 220 and engaged with the lock grooves 120 are provided to a fixing block 300 having an insulating property. Fitting of the conductive pins 310 and lock pins 320 of the fixing block 300 electrically and mechanically couples the module 100 and the control circuit board 200. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
