| 摘要 |
PROBLEM TO BE SOLVED: To provide a food packaging structure for a shock wave processing which does not generate pinholes in a packaging material by shock wave when a food is processed by applying the shock wave. SOLUTION: The food packaging structure for packaging the food to soften the food by the shock wave processing, is prepared by storing the food in a storing recessed part of a tray-like bottom film 1 formed by using a heat-shrinkable film as a material by a deep drawing, covering the upper end of the storing recessed part with a top film 4 consisting of a heat-shrinkable film, making a space between the bottom film 1 and the top film 4 under a vacuum condition, and joining the top film 4 on the upper end of the bottom film 1 by heat sealing, and is prepared by heat-shrinking the bottom film 1 and the top film 4 of the package vacuum-packaged. COPYRIGHT: (C)2011,JPO&INPIT |
