| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming device having a mechanism which reduces stress generated at a heater and a heater support portion when a wafer is heated. SOLUTION: The film forming device 100 includes a chamber 102, the heater 121 configured to heat the silicon wafer 101 mounted in the chamber 102, and a conductive booth bar 123b supporting the heater 121, wherein the booth bar 123b has an elastic portion as a part of its structure. The elastic portion is a leaf spring portion 125 having a cut 125a made in a direction perpendicular to a direction wherein stress due to heating of the heater 121 acts on the booth bar 123b. COPYRIGHT: (C)2011,JPO&INPIT
|
