发明名称 INGOT CUTTING APPARATUS AND METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an ingot cutting apparatus and method which maintain stably the ingot a seating state at the end of ingot cutting, suppress the generation of broken pieces and chips during ingot cutting, and thereby can improve the yield of products. <P>SOLUTION: The ingot cutting apparatus includes at least a V-shaped process pad which is disposed on the top surface of a cutting table and interposed in between the ingot mounted on the cutting table. The V-shaped process pad fills a grain material in a pad body, absorbs the air fed from the feeding portion of the pad body, reduces the pressure, and further forms the surface shape by hardening the grain material. In this manner, the pressure of the V-shaped process pad is reduced, and the surface shape of the mounting surface of the V-shaped process pad is formed so as to be along the surface shape of the mounted ingot, Thereby, the ingot is brought into close contact with the V-shaped process pad for ingot cutting. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010267941(A) 申请公布日期 2010.11.25
申请号 JP20090122785 申请日期 2009.05.21
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 NISHINO HIDEHIKO;OGUCHI TAKEAKI;HIRANO YOSHIHIRO
分类号 H01L21/304;B24B27/06;B28D7/04 主分类号 H01L21/304
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