| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device achieving simplification of an electric wiring and high-speed signal transmission between semiconductor elements. <P>SOLUTION: In a semiconductor device 1, memory ICs 2A and 2B and semiconductor chips for peripheral circuits, such as an optical I/O circuit and an I/F circuit, not shown are mounted so as to surround a land group 51 on a substrate 5 having the land group 51 including lands for low-speed transmission, power supply and the like. Further, an MPU 6 as a control semiconductor chip is mounted in a portion of the semiconductor chips for peripheral circuits. In the semiconductor chips for peripheral circuits, a first electrode portion 21, etc. including a plurality of electrodes for high-speed transmission are provided at one side on the land group 51 side. A second electrode portion 62 having the same configuration as that of the first electrode portion, etc. is provided around the MPU 6 so as to face the electrode portion 21, etc. Signal transmission without contact is performed between electrodes facing each other between the electrode portion 21 and the electrode portion 62. <P>COPYRIGHT: (C)2011,JPO&INPIT |
