发明名称 |
PHOTOCURABLE HEAT-CURABLE RESIN COMPOSITION, DRY FILM AND CURED PRODUCT OF THE COMPOSITION, AND PRINTED WIRING BOARD UTILIZING THOSE MATERIALS |
摘要 |
<p>Disclosed are: a photocurable heat-curable resin composition which enables the formation of a cured coating film having PCT resistance, HAST resistance, electroless gold plating resistance and thermal shock resistance that are important properties for solder resists for semiconductor packages; a dry film and a cured product of the resin composition; and a printed wiring board having, formed thereon, a cured coating film (e.g., a solder resist) comprising those materials. Specifically disclosed is a photocurable heat-curable resin composition which is developable with an aqueous alkaline solution and comprises a carboxyl-group-containing resin having a photosensitive group (excluding a carboxyl-group-containing resin produced using an epoxy resin as a starting raw material), a photopolymerization initiator and a hydroxyl-group-containing elastomer.</p> |
申请公布号 |
WO2010134314(A1) |
申请公布日期 |
2010.11.25 |
申请号 |
WO2010JP03311 |
申请日期 |
2010.05.17 |
申请人 |
TAIYO INK MFG. CO., LTD.;ITO, NOBUHITO;ARIMA, MASAO |
发明人 |
ITO, NOBUHITO;ARIMA, MASAO |
分类号 |
G03F7/038;G03F7/004;G03F7/033;H05K3/28 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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