发明名称 |
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE |
摘要 |
<p>Disclosed is a semiconductor device comprising a thin film transistor and a thin film diode, wherein a semiconductor layer (113) of the thin film transistor and a semiconductor layer (114) of the thin film diode are both crystalline semiconductor layers, the semiconductor layer (113) of the thin film transistor and the semiconductor layer (114) of the thin film diode respectively contain portions that are formed by crystallizing the same amorphous semiconductor film, the thickness of the semiconductor layer (114) of the thin film diode is larger than the thickness of the semiconductor layer (113) of the thin film transistor, the difference between the thickness of the semiconductor layer (113) of the thin film transistor and the thickness of the semiconductor layer (114) of the thin film diode is more than 25 nm, and the surface roughness of the semiconductor layer (114) of the thin film diode is larger than the surface roughness of the semiconductor layer (113) of the thin film transistor. As a result, the thin film transistor and the thin film diode achieve respective required characteristics.</p> |
申请公布号 |
WO2010134571(A1) |
申请公布日期 |
2010.11.25 |
申请号 |
WO2010JP58531 |
申请日期 |
2010.05.20 |
申请人 |
SHARP KABUSHIKI KAISHA;YAMANAKA MASAKI;NAKATSUJI HIROSHI;MAKITA NAOKI |
发明人 |
YAMANAKA MASAKI;NAKATSUJI HIROSHI;MAKITA NAOKI |
分类号 |
H01L27/14;G02F1/1365;G02F1/1368;G09F9/33;H01L21/20;H01L21/336;H01L29/786 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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