发明名称 HOLDING UNIT OF WORKPIECE
摘要 PROBLEM TO BE SOLVED: To provide a holding unit of a workpiece which facilitates handling of the workpiece and is repeatedly used. SOLUTION: The holding unit of the workpiece is used in a cutting device having a holding table for sucking and holding of the workpiece, and a cutting blade for forming a cutting groove in the workpiece sucked and held by the holding table. The holding unit of the workpiece includes a substrate 50 having a mounting region on which the workpiece is mounted and a displacement prevention means for preventing displacement of the workpiece, an adhesive sheet 60 attached to the substrate, and an annular frame 62 attached on an outer peripheral edge of the adhesive sheet. A plurality of through-holes passing through the substrate and the adhesive sheet are formed in the mounting region of the substrate and the adhesive sheet. As the workpiece is mounted on the substrate and sucked and held on the holding table, the workpiece and the holding unit of the workpiece are integrally held by the holding table. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010264575(A) 申请公布日期 2010.11.25
申请号 JP20090119674 申请日期 2009.05.18
申请人 DISCO ABRASIVE SYST LTD 发明人 OTANI HIDEAKI
分类号 B24B41/06;B24B53/00;H01L21/301 主分类号 B24B41/06
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