| 摘要 |
A carrier apparatus positions a chuck member (108) above a wafer (W) mounted on a fine movement stage (WFS2), relatively moves the chuck member (108) and the fine movement stage(WFS2) in a vertical direction, makes the chuck member (108) approach a position which is a predetermined distance away from the upper surface of the wafer (W), makes the chuck member(108) hold the wafer (W) from above in a non-contact manner, and makes the chuck member holding the wafer and the fine movement stage move apart within a predetermined plane after making the chuck member holding the wafer and the fine movement stage move apart in the vertical direction. Further, the carrier apparatus loads the wafer (W) held in a non-contact manner from above by the chuck member on the fine movement stage. Therefore, it is not necessary to form or provide a notch to house an arm and the like used in the wafer exchange on a holding member such as a wafer holder on the fine movement stage, and a vertical movement member used in the delivery of the wafer, in the holding member. |
