METHOD FOR MEASURING A THREE-DIMENSIONAL SHAPE

摘要

The present invention relates to a method for measuring a three-dimensional shape. The method for measuring the three-dimensional shape of an object having a substrate and a solder ball arranged on the substrate, comprises: a center-determining step of obtaining an image of the solder ball and determining the center of the solder ball; an image-acquiring step of forming a sine wave pattern on the object, and acquiring an integrated image containing images of both the upper surface of the substrate and of the solder ball; a phase value determination step of selecting, from within the integrated image, a reference line which is a virtual line passing through the center of the solder ball, extracting the phase value of the portion onto which the sine wave pattern is projected from the center of the solder ball located on the reference line and determining the extracted phase value to be a phase value of the center of the solder ball, and extracting the phase value of the portion onto which the sine wave pattern is projected from the substrate located on the reference line and determining the extracted phase value to be a phase value of the substrate; and a height calculating step of calculating the height from the upper surface of the substrate to the center of the solder ball using the difference between the phase value of the center of the solder ball and the phase value of the substrate.