There is provided a probe block. The probe block includes a probe including first contact portions, second contact portions, and beams connecting the first contact portion to the second contact portion and a guide where the probe is inserted and supported. The probe block is installed in a probe card for inspecting a semiconductor chip. The guide includes a first part formed of a plurality of upper holes wherein the first contact portions of the probe are inserted therein to penetrate; a second part formed of a plurality of lower holes wherein the second contact portions of the probe are inserted therein to penetrate; and a third part including a center hole wherein beams of the respective probes inserted in the upper holes and the lower holes are commonly inserted, the third part disposed between the first part and the second part. The upper holes and the lower holes are located on a plane vertically extended from the center hole.
