| 摘要 |
<p>A connection device (300) includes an inner-layer GND (340) that is provided in the inner layer of a multilayer ceramic substrate (300a), a first transmission path (310) that is provided via a dielectric layer on the inner-layer GND (340), and a surface GND (320) and leads (360, 370) that are electrically connected to and is provided in the inner-layer GND (340). The leads (360, 370) are fitted into through-holes provided in a second transmission path and a GND layer on a flexible substrate to be connected.</p> |
