| 摘要 |
PURPOSE: A high heat radiation type high frequency device package is provided to improve heat radiation performance and to prevent the separation of an electronic part like a heat-sink. CONSTITUTION: A space part(30a) includes a high frequency device(20) in the center of a heat-sink(10). The heat-sink includes a top plate, a bottom plate, and a center plate. An insertion space part is formed on the center of the center plate. The top plate, the center plate, and the bottom plate are made of copper. |
